No CLean Solder Flux 4%

B.I.C No Clean Liquid Flux 4%

Model: No Clean 4% Flux        

Features:                                                         

   Low solid Content, No-clean organic flux.      

   Non-corrosive and Non-conductive flux

     Leave minimal post-process residues that are pin testable without cleaning.

   Apply to Circuit Boards by a spray, foam or dip process.

Improves Solder Shine.

• No Surface Insulation degradation.
• No offensive odors.
• ROHS Compliant.
• Compatible with all types of Solder